Advanced Concepts in Metrology Toolset Stability and Matching

Level: Intermediate Length: 4 hours Format: In-Person Lecture Intended Audience: Scientists, engineers, technicians, or managers, from academia, and patterning groups in the FAB, who wish to learn more about metrology, measurement uncertainty, and process control fundamentals, and how to manage and maintain a metrology toolset. Beyond the fundamentals, new metrics and methodologies are introduced enabling metrology for upcoming inflections of 3D FinFET and 3D flash (VNAND, TCAT, BICS) device. Undergraduate training in engineering or science is assumed. Description: The course covers advanced concepts for metrology toolset stability and matching. It will cover many critical topics that together maximize fleet performance. This is especially important given the shift to new device architectures (finfet, 3D Flash, DRAM and advanced memory ) that are challenging metrology toolsets in ways not seen before. A number of advanced concepts will be covered. Review best known methods for gauge study analysis and metrics. Appropriately setting up tool control chart limits for long term stability fleet matching based on requirements not historical data. Leveraging real time normalized product data to decrease Mean Time To Detect (MTTD) tool drifts. Recipe portability matching and monitoring to catch other issues that will affect lot cycletime. The concepts discussed are applicable to any metrology toolset such as CD-SEM, overlay, thin film, AFM, etc. and most of these concepts are also applicable to defect toolsets. Learning Outcomes: This course will enable you to: - identify the metrology challenges involved in development and process control of new device (finFET,3D NAND) and advanced patterning technologies - describe the traditional metrics and methodologies used as building blocks to assess the performance of a homogeneous and heterogeneous metrology toolset - operate on a new and improved set of metrics and methodologies inspired from limitations in the traditional metrics and methodologies and derived from the new device and patterning challenges - define success criteria for qualifying and ensuring long term stability of the metrology toolset - apply these metrics and methodologies to help speed up development cycles of learning and improve process control and cycle-time in chip manufacturing - explain the fundamental components of measurement uncertainty - set control limits for toolset monitoring using requirements instead of historical data and leverage to drive continuous improvement - distinguish what normalized product is and how it can be used to decrease MTTD of tool drifts - explain and monitor the aspects of the metrology toolset than can affect the recipe performance across the fleet - classify the fundamental aspects of cost of ownership and tradeoffs associated with fleet management Instructor(s): Ofer Adan is the is head of patterning control and technology at Applied Materials. He also assistant chair for the Metrology, Inspection, and Process Control for Microlithography XXXIII . Member of SPIE advanced lithography steering committee for the metrology inspection and process control conference. Recipient of 2010 Diana Nyyssonen memorial award from SPIE for the best paper on metrology. Ofer is an author of more than 30 papers, and several patents in the field of metrology. He holds his MSc. in electronic materials engineering from Ben Gurion University. Event: SPIE Advanced Lithography + Patterning 2023 Course Held: 26 February 2023