High NA Lithography Systems: What’s in the Box?

Level: Intermediate Length: 4 hours Format: In-Person Lecture Intended Audience: This course is designed for engineers, technicians and managers in lithography development and manufacturing who wish to learn about the main characteristics and components of a High NA lithography system. It is also intended for those who have a general interest in the lithography technology. Description: This course provides attendees with an overview of the advances in lithography systems for High NA and an understanding of their inner workings, the technology and basic principles. The primary goal of the course is to discuss the main components of a High NA scanner, understand their function and link them to critical performance metrics. The commonalities and main differences between DUV and EUV scanners will be discussed, and the insights into High NA, next generation of EUV lithography systems will be given. Learning Outcomes: This course will enable you to: - explain the history and basics of the development of lithography machines, and how these systems enable further scaling for semiconductor technology - describe the main components of an EUV scanner (including key modules and sensors) and their functions - list the critical performance metrics relevant for the scanner and their optimization - differentiate scanner technology types (DUV, EUV) and explain High NA EUV technology characteristics (current status, benefits and technical challenges) Instructor(s): Jara G. Garcia-Santaclara is EUV High NA Product Manager at ASML, the largest supplier of photolithography systems for the semiconductor industry. She has broad experience in EUV scanner performance and usage, EUV processing and lithography. Jara is internationally recognized for collaborations carried out with resist and materials suppliers within the EUV ecosystem, and for the work presented in several related conference papers, including a SPIE Materials Keynote in 2021. Jan van Schoot , PhD, Director of System Engineering, ASML, Netherlands. After his study Electrical Engineering (Cum Laude) at Twente University of Technology, he received his PhD in Physics on the subject of non-linear optical waveguide devices and held a post-doc position studying waveguide based electro-optical modulators. He joined ASML in 1996 and held several positions related to Imaging and Optics. In 2007 he joined System Engineering. He was responsible for the Optical Columns of the 0.25NA and 0.33NA EUV systems and the EUV source. He was the study leader of the High NA EUV system and is now responsible for the High NA optical train. He is a Sr. Member of the SPIE, holds over 35 patents and presents frequently at conferences about photo lithography. Event: SPIE Advanced Lithography + Patterning 2025 Course Held: 23 February 2025